Direct Melt-Calendaring of Highly Textured (Bi,Sb)

direct melt‐calendaring highly textured structure strain engineering thermoelectric thick films

Journal

Small methods
ISSN: 2366-9608
Titre abrégé: Small Methods
Pays: Germany
ID NLM: 101724536

Informations de publication

Date de publication:
27 Jun 2024
Historique:
revised: 14 06 2024
received: 25 04 2024
medline: 27 6 2024
pubmed: 27 6 2024
entrez: 27 6 2024
Statut: aheadofprint

Résumé

The evolutions of chip thermal management and micro energy harvesting put forward urgent need for micro thermoelectric devices. Nevertheless, low-performance thermoelectric thick films as well as the complicated precision cutting process for hundred-micron thermoelectric legs still remain the bottleneck hindering the advancement of micro thermoelectric devices. In this work, an innovative direct melt-calendaring manufacturing technology is first proposed with specially designed and assembled equipment, that enables direct, rapid, and cost-effective continuous manufacturing of Bi

Identifiants

pubmed: 38934342
doi: 10.1002/smtd.202400589
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

e2400589

Subventions

Organisme : National Key R&D Program of China
ID : 2018YFA0702100
Organisme : National Key R&D Program of China
ID : 2023YFC3011001
Organisme : National Natural Science Foundation of China
ID : U21A2079
Organisme : Beijing Natural Science Foundation
ID : 2222057
Organisme : Beijing Nova Program
ID : 20230484412

Informations de copyright

© 2024 Wiley‐VCH GmbH.

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Auteurs

Siming Guo (S)

School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.

Wei Zhu (W)

School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.
Key Laboratory of Intelligent Sensing Materials and Chip Integration Technology of Zhejiang Province, Hangzhou Innovation Institute of Beihang University, Hangzhou, 310051, China.

Guangyu Han (G)

School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.

Qingqing Zhang (Q)

Key Laboratory of Intelligent Sensing Materials and Chip Integration Technology of Zhejiang Province, Hangzhou Innovation Institute of Beihang University, Hangzhou, 310051, China.

Jie Zhou (J)

School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.

Zhanpeng Guo (Z)

Key Laboratory of Intelligent Sensing Materials and Chip Integration Technology of Zhejiang Province, Hangzhou Innovation Institute of Beihang University, Hangzhou, 310051, China.

Shucheng Bao (S)

School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.

Yutong Liu (Y)

School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.

Shijie Zhao (S)

Key Laboratory of Intelligent Sensing Materials and Chip Integration Technology of Zhejiang Province, Hangzhou Innovation Institute of Beihang University, Hangzhou, 310051, China.

Boyi Wang (B)

Key Laboratory of Intelligent Sensing Materials and Chip Integration Technology of Zhejiang Province, Hangzhou Innovation Institute of Beihang University, Hangzhou, 310051, China.

Yuan Deng (Y)

School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.
Key Laboratory of Intelligent Sensing Materials and Chip Integration Technology of Zhejiang Province, Hangzhou Innovation Institute of Beihang University, Hangzhou, 310051, China.

Classifications MeSH