Crossmodal sensory neurons based on high-performance flexible memristors for human-machine in-sensor computing system.


Journal

Nature communications
ISSN: 2041-1723
Titre abrégé: Nat Commun
Pays: England
ID NLM: 101528555

Informations de publication

Date de publication:
23 Aug 2024
Historique:
received: 05 03 2024
accepted: 13 08 2024
medline: 24 8 2024
pubmed: 24 8 2024
entrez: 23 8 2024
Statut: epublish

Résumé

Constructing crossmodal in-sensor processing system based on high-performance flexible devices is of great significance for the development of wearable human-machine interfaces. A bio-inspired crossmodal in-sensor computing system can perform real-time energy-efficient processing of multimodal signals, alleviating data conversion and transmission between different modules in conventional chips. Here, we report a bio-inspired crossmodal spiking sensory neuron (CSSN) based on a flexible VO

Identifiants

pubmed: 39179548
doi: 10.1038/s41467-024-51609-x
pii: 10.1038/s41467-024-51609-x
doi:

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

7275

Subventions

Organisme : National Natural Science Foundation of China (National Science Foundation of China)
ID : Grant No. 62175248

Informations de copyright

© 2024. The Author(s).

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Auteurs

Zhiyuan Li (Z)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.
Hubei Yangtze Memory Laboratories, Wuhan, China.

Zhongshao Li (Z)

State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, China.
Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, China.

Wei Tang (W)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.

Jiaping Yao (J)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.

Zhipeng Dou (Z)

State Key Laboratory of Catalysis, CAS Center for Excellence in Nanoscience, Dalian Institute of Chemical Physics, Chinese Academy of Sciences, Dalian, China.

Junjie Gong (J)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.

Yongfei Li (Y)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.

Beining Zhang (B)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.

Yunxiao Dong (Y)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.

Jian Xia (J)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China.

Lin Sun (L)

State Key Laboratory of Catalysis, CAS Center for Excellence in Nanoscience, Dalian Institute of Chemical Physics, Chinese Academy of Sciences, Dalian, China.

Peng Jiang (P)

State Key Laboratory of Catalysis, CAS Center for Excellence in Nanoscience, Dalian Institute of Chemical Physics, Chinese Academy of Sciences, Dalian, China.

Xun Cao (X)

State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, China. cxun@mail.sic.ac.cn.
Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, China. cxun@mail.sic.ac.cn.

Rui Yang (R)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China. yangrui@hust.edu.cn.
Hubei Yangtze Memory Laboratories, Wuhan, China. yangrui@hust.edu.cn.

Xiangshui Miao (X)

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China. miaoxs@hust.edu.cn.
Hubei Yangtze Memory Laboratories, Wuhan, China. miaoxs@hust.edu.cn.

Ronggui Yang (R)

State Key Laboratory of Coal Combustion, School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, China.

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