Tom Scherzer

Publications (1)

Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications.

Micromachines
Avec: Tim Scherzer , Marius Wolf , Kai Werum , Holger Ruckdäschel , Wolfgang Eberhardt , André Zimmermann

Réseau de co-auteurs

Tim Scherzer 1 collaboration
Marius Wolf 1 collaboration
Kai Werum 1 collaboration
Holger Ruckdäschel 1 collaboration
Wolfgang Eberhardt 1 collaboration
André Zimmermann 1 collaboration