Antimicrobial second skin using copper nanomesh.


Journal

Proceedings of the National Academy of Sciences of the United States of America
ISSN: 1091-6490
Titre abrégé: Proc Natl Acad Sci U S A
Pays: United States
ID NLM: 7505876

Informations de publication

Date de publication:
14 06 2022
Historique:
entrez: 9 6 2022
pubmed: 10 6 2022
medline: 14 6 2022
Statut: ppublish

Résumé

The functional support and advancement of our body while preserving inherent naturalness is one of the ultimate goals of bioengineering. Skin protection against infectious pathogens is an application that requires common and long-term wear without discomfort or distortion of the skin functions. However, no antimicrobial method has been introduced to prevent cross-infection while preserving intrinsic skin conditions. Here, we propose an antimicrobial skin protection platform copper nanomesh, which prevents cross-infectionmorphology, temperature change rate, and skin humidity. Copper nanomesh exhibited an inactivation rate of 99.99% for

Identifiants

pubmed: 35679344
doi: 10.1073/pnas.2200830119
doi:

Substances chimiques

Anti-Infective Agents 0
Copper 789U1901C5

Types de publication

Journal Article Research Support, Non-U.S. Gov't

Langues

eng

Sous-ensembles de citation

IM

Pagination

e2200830119

Auteurs

Jae Joon Kim (JJ)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Siyoung Ha (S)

Infectious Disease Research Center, Korea Research Institute of Bioscience and Biotechnology (KRIBB), Daejeon 34141, South Korea.

Lina Kim (L)

Infectious Disease Research Center, Korea Research Institute of Bioscience and Biotechnology (KRIBB), Daejeon 34141, South Korea.

Yutaro Kato (Y)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Yan Wang (Y)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Chihiro Okutani (C)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Haoyang Wang (H)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Chunya Wang (C)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Kenjiro Fukuda (K)

Center for Emergent Matter Science & Thin-Film Device Laboratory RIKEN 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.

Sunghoon Lee (S)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Tomoyuki Yokota (T)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.

Oh Seok Kwon (OS)

Infectious Disease Research Center, Korea Research Institute of Bioscience and Biotechnology (KRIBB), Daejeon 34141, South Korea.
Department of Nanobiotechnology, Korea University of Science and Technology (UST), Daejeon 34141, South Korea.

Takao Someya (T)

Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
Center for Emergent Matter Science & Thin-Film Device Laboratory RIKEN 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.

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Classifications MeSH