Morphological and physiological responses of Dianthus spiculifolius high wax mutant to low-temperature stress.
Cuticular wax
Dianthus spiculifolius
Low-temperature stress
Morphological responses
Physiological responses
Journal
Journal of plant physiology
ISSN: 1618-1328
Titre abrégé: J Plant Physiol
Pays: Germany
ID NLM: 9882059
Informations de publication
Date de publication:
Aug 2022
Aug 2022
Historique:
received:
18
04
2022
revised:
19
06
2022
accepted:
01
07
2022
pubmed:
13
7
2022
medline:
26
7
2022
entrez:
12
7
2022
Statut:
ppublish
Résumé
Cuticular wax plays a role in plant responses to environmental stresses. To understand the contribution of cuticular wax to plant responses to low-temperature stress, the morphological and physiological responses of a Dianthus spiculifolius high-wax (HW) mutant and wild type (WT) were compared. Under low-temperature stress (0 and -10 °C), HW plants showed a lower mortality rate and electrolyte leakage (El) than that WT plants. In plants treated with low-temperature stress (0 and -10 °C), HW mutant leaves exhibited higher soluble sugar and free proline contents and lower malondialdehyde contents than those WT leaves. The photosynthetic capacity, net photosynthetic rate, stomatal conductance, and maximal photochemical efficiency of photosystem II in HW mutant leaves were the least inhibited by low temperature than those in WT leaves. The dewaxing experiments showed no significant difference in the phenotype and El between the dewaxed-treated HW mutant and WT leaves under low-temperatures stress, indicating that cuticular wax causes differences in resistance to low-temperatures between HW and WT. Principal component analysis and the membership function value of the physiological data showed that the average membership value of the HW mutant was greater than that in WT. In general, the results indicated that high cuticular wax contributes positively to the response to low-temperature stress by D. spiculifolius.
Identifiants
pubmed: 35820348
pii: S0176-1617(22)00148-1
doi: 10.1016/j.jplph.2022.153762
pii:
doi:
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM
Pagination
153762Informations de copyright
Copyright © 2022. Published by Elsevier GmbH.