Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte.
Bismuth
Copper
EDTA
Electroplating
Lead
Superconformal
Thallium
Journal
Journal of the Electrochemical Society
ISSN: 0013-4651
Titre abrégé: J Electrochem Soc
Pays: England
ID NLM: 7505603
Informations de publication
Date de publication:
2022
2022
Historique:
entrez:
6
3
2023
pubmed:
1
1
2022
medline:
1
1
2022
Statut:
ppublish
Résumé
Catalysis of Cu deposition from a near-neutral Cu
Identifiants
pubmed: 36875632
doi: 10.1149/1945-7111/ac8baf
pmc: PMC9982825
mid: NIHMS1874100
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : Intramural NIST DOC
ID : 9999-NIST
Pays : United States
Références
J Electrochem Soc. 2019;166(1):
pubmed: 33029031
J Electrochem Soc. 2019;166(12):
pubmed: 33041356
J Electrochem Soc. 2019;166(16):
pubmed: 33041357
J Electrochem Soc. 2020;167:
pubmed: 33223561