D Josell

Affiliations

Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 USA.

Publications (21)

Extreme Bottom-up Gold Filling of High Aspect Ratio Features.

Accounts of chemical research

Avec: Daniel Josell , Thomas P Moffat

Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias.

Journal of the Electrochemical Society

Avec: S-H Kim , T M Braun , H-J Lee , T P Moffat , D Josell

Implementation of a dual-phase grating interferometer for multi-scale characterization of building materials by tunable dark-field imaging.

Scientific reports

Avec: Caori Organista , Ruizhi Tang , Zhitian Shi , Konstantins Jefimovs , Daniel Josell , Lucia Romano , Simon Spindler , Pierre Kibleur , Benjamin Blykers , Marco Stampanoni , Matthieu N Boone

A four-grating interferometer for x-ray multi-contrast imaging.

Medical physics

Avec: Houxun Miao , James C Williams , Daniel Josell

Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte.

Journal of the Electrochemical Society

Avec: D Josell , T P Moffat

Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias.

Journal of the Electrochemical Society

Avec: D Josell , L A Menk , A E Hollowell , M Blain , T P Moffat

Fabrication of a fractal pattern device for focus characterizations of X-ray imaging systems by Si deep reactive ion etching and bottom-up Au electroplating.

Applied optics

Avec: Zhitian Shi , Daniel Josell , Konstantins Jefimovs , Lucia Romano , Thomas P Moffat , Marco Stampanoni , Christian M Schlepütz

Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte.

Journal of the Electrochemical Society

Avec: D Josell , T P Moffat

Bottom-up Cu filling of annular through silicon vias: Microstructure and texture.

Electrochimica acta

Avec: Sang-Hyeok Kim , Hyo-Jong Lee , Daniel Josell , Thomas P Moffat

Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology.

Accounts of chemical research

Avec: Thomas P Moffat , Trevor M Braun , David Raciti , Daniel Josell

Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray Interferometry.

Journal of the Electrochemical Society

Avec: D Josell , Z Shi , K Jefimovs , V Guzenko , C Beauchamp , L Peer , M Polikarpov , T P Moffat

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias.

Journal of the Electrochemical Society

Avec: S-H Kim , H-J Lee , T M Braun , T P Moffat , D Josell

Additives for Superconformal Gold Feature Filling.

Journal of the Electrochemical Society

Avec: D Josell , T P Moffat

Robust Bottom-Up Gold Filling of Deep Trenches and Gratings.

Journal of the Electrochemical Society

Avec: D Josell , W Osborn , M E Williams , H Miao

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias.

Journal of the Electrochemical Society

Avec: T M Braun , D Josell , M Silva , J Kildon , T P Moffat

Accelerated Bottom-Up Gold Filling of Metallized Trenches.

Journal of the Electrochemical Society

Avec: D Josell , M E Williams , S Ambrozik , C Zhang , T P Moffat

Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings.

Journal of the Electrochemical Society

Avec: D Josell , S Ambrozik , M E Williams , A E Hollowell , C Arrington , S Muramoto , T P Moffat

Effect of oblique versus normal deposition orientation on the properties of perpendicularly magnetized L1

IEEE transactions on magnetics

Avec: Xinjun Wang , Sergiy Krylyuk , Daniel Josell , Delin Zhang , Jian-Ping Wang , Daniel B Gopman

Simulation of Copper Electrodeposition in Through-Hole Vias.

Journal of the Electrochemical Society

Avec: T M Braun , D Josell , J John , T P Moffat

Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling.

Journal of the Electrochemical Society

Avec: D Josell , T M Braun , T P Moffat

Emission Ghost Imaging: reconstruction with data augmentation.

Physical review. A

Avec: K J Coakley , H H Chen-Mayer , B Ravel , D Josell , N N Klimov , D S Hussey , S M Robinson

Réseau de co-auteurs

T P Moffat 12 collaborations

Daniel Josell 7 collaborations

T M Braun 5 collaborations

Thomas P Moffat 4 collaborations

M E Williams 3 collaborations

S-H Kim 2 collaborations

H-J Lee 2 collaborations

Zhitian Shi 2 collaborations

Konstantins Jefimovs 2 collaborations

Lucia Romano 2 collaborations

Marco Stampanoni 2 collaborations

A E Hollowell 2 collaborations

S Ambrozik 2 collaborations

Caori Organista 1 collaboration

Ruizhi Tang 1 collaboration

Simon Spindler 1 collaboration

Pierre Kibleur 1 collaboration

Benjamin Blykers 1 collaboration

Matthieu N Boone 1 collaboration

Houxun Miao 1 collaboration

James C Williams 1 collaboration

L A Menk 1 collaboration

M Blain 1 collaboration

Christian M Schlepütz 1 collaboration

Sang-Hyeok Kim 1 collaboration

Hyo-Jong Lee 1 collaboration

Trevor M Braun 1 collaboration

David Raciti 1 collaboration

Z Shi 1 collaboration

K Jefimovs 1 collaboration

V Guzenko 1 collaboration

C Beauchamp 1 collaboration

L Peer 1 collaboration

M Polikarpov 1 collaboration

W Osborn 1 collaboration

H Miao 1 collaboration

M Silva 1 collaboration

J Kildon 1 collaboration

C Zhang 1 collaboration

C Arrington 1 collaboration

S Muramoto 1 collaboration

Xinjun Wang 1 collaboration

Sergiy Krylyuk 1 collaboration

Delin Zhang 1 collaboration

Jian-Ping Wang 1 collaboration

Daniel B Gopman 1 collaboration

J John 1 collaboration

K J Coakley 1 collaboration

H H Chen-Mayer 1 collaboration

B Ravel 1 collaboration

N N Klimov 1 collaboration

D S Hussey 1 collaboration

S M Robinson 1 collaboration