Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray Interferometry.
Electroplating
Talbot interferometer
X-ray optics
X-ray wave front sensing
chessboard gratings
deep reactive ion etching
Journal
Journal of the Electrochemical Society
ISSN: 0013-4651
Titre abrégé: J Electrochem Soc
Pays: England
ID NLM: 7505603
Informations de publication
Date de publication:
2021
2021
Historique:
entrez:
20
3
2023
pubmed:
1
1
2021
medline:
1
1
2021
Statut:
ppublish
Résumé
An extreme bottom-up filling variant of superconformal Au electrodeposition yielding void-free filling of recessed features is demonstrated with diffraction gratings composed of a two-dimensional patterned "chessboard" array of square vias of aspect ratio (depth/width) ≈ 23 as well as one-dimensional arrays of trenches having aspect ratios exceeding 50 and 65. Deposition on planar and patterned substrates is examined in several near-neutral x mol·L
Identifiants
pubmed: 36938320
doi: 10.1149/1945-7111/ac1d7e
pmc: PMC10020954
mid: NIHMS1874086
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : Intramural NIST DOC
ID : 9999-NIST
Pays : United States
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