Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias.
Journal
Journal of the Electrochemical Society
ISSN: 0013-4651
Titre abrégé: J Electrochem Soc
Pays: England
ID NLM: 7505603
Informations de publication
Date de publication:
2021
2021
Historique:
entrez:
20
3
2023
pubmed:
1
1
2021
medline:
1
1
2021
Statut:
ppublish
Résumé
The microstructure of copper filled through silicon vias deposited in a CuSO
Identifiants
pubmed: 36936718
doi: 10.1149/1945-7111/ac2bea
pmc: PMC10020985
mid: NIHMS1874090
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : Intramural NIST DOC
ID : 9999-NIST
Pays : United States
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