Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias.
Journal
Journal of the Electrochemical Society
ISSN: 0013-4651
Titre abrégé: J Electrochem Soc
Pays: England
ID NLM: 7505603
Informations de publication
Date de publication:
2022
2022
Historique:
entrez:
20
3
2023
pubmed:
1
1
2022
medline:
1
1
2022
Statut:
ppublish
Résumé
The microstructure and crystallographic texture of copper electrodeposits in millimeter scale through silicon vias are characterized using electron backscatter diffraction. The deposits obtained from additive-containing CuSO
Identifiants
pubmed: 36936546
doi: 10.1149/1945-7111/ac5ad8
pmc: PMC10020947
mid: NIHMS1874083
doi:
Types de publication
Journal Article
Langues
eng
Subventions
Organisme : Intramural NIST DOC
ID : 9999-NIST
Pays : United States
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