3D printable high-performance conducting polymer hydrogel for all-hydrogel bioelectronic interfaces.


Journal

Nature materials
ISSN: 1476-4660
Titre abrégé: Nat Mater
Pays: England
ID NLM: 101155473

Informations de publication

Date de publication:
Jul 2023
Historique:
received: 28 01 2022
accepted: 03 05 2023
medline: 3 7 2023
pubmed: 16 6 2023
entrez: 15 6 2023
Statut: ppublish

Résumé

Owing to the unique combination of electrical conductivity and tissue-like mechanical properties, conducting polymer hydrogels have emerged as a promising candidate for bioelectronic interfacing with biological systems. However, despite the recent advances, the development of hydrogels with both excellent electrical and mechanical properties in physiological environments is still challenging. Here we report a bi-continuous conducting polymer hydrogel that simultaneously achieves high electrical conductivity (over 11 S cm

Identifiants

pubmed: 37322141
doi: 10.1038/s41563-023-01569-2
pii: 10.1038/s41563-023-01569-2
doi:

Substances chimiques

Polymers 0
Hydrogels 0

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

895-902

Informations de copyright

© 2023. The Author(s), under exclusive licence to Springer Nature Limited.

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Auteurs

Tao Zhou (T)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
Department of Engineering Science and Mechanics, Center for Neural Engineering, The Pennsylvania State University, University Park, PA, USA.

Hyunwoo Yuk (H)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. hyunwooyuk@sanaheal.com.
SanaHeal, Inc, Cambridge, MA, USA. hyunwooyuk@sanaheal.com.

Faqi Hu (F)

Flexible Electronics Innovation Institute, Jiangxi Key Laboratory of Flexible Electronics, Jiangxi Science and Technology Normal University, Nanchang, China.

Jingjing Wu (J)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.

Fajuan Tian (F)

Flexible Electronics Innovation Institute, Jiangxi Key Laboratory of Flexible Electronics, Jiangxi Science and Technology Normal University, Nanchang, China.

Heejung Roh (H)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.

Zequn Shen (Z)

Robotics Institute, School of Mechanical Engineering, State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, China.

Guoying Gu (G)

Robotics Institute, School of Mechanical Engineering, State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, China.

Jingkun Xu (J)

Flexible Electronics Innovation Institute, Jiangxi Key Laboratory of Flexible Electronics, Jiangxi Science and Technology Normal University, Nanchang, China.

Baoyang Lu (B)

Flexible Electronics Innovation Institute, Jiangxi Key Laboratory of Flexible Electronics, Jiangxi Science and Technology Normal University, Nanchang, China. luby@jxstnu.edu.cn.

Xuanhe Zhao (X)

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. zhaox@mit.edu.
Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. zhaox@mit.edu.

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