Electrodeposition and analysis of thick bismuth films.
Journal
Scientific reports
ISSN: 2045-2322
Titre abrégé: Sci Rep
Pays: England
ID NLM: 101563288
Informations de publication
Date de publication:
21 Jan 2023
21 Jan 2023
Historique:
received:
09
11
2022
accepted:
11
01
2023
entrez:
21
1
2023
pubmed:
22
1
2023
medline:
25
1
2023
Statut:
epublish
Résumé
Due to its unique physical and chemical properties, bismuth is an attractive candidate for a wide range of applications such as battery anodes, radiation shielding, and semiconductors, to name a few. This work presents the electrodeposition of mechanically stable and homogenous bismuth films at micron-scale thicknesses. A simple one-step electrodeposition process using either a pulse/reverse or direct current source yielded thick, homogenous, and mechanically stable bismuth films. Morphology, electrochemical behavior, adhesion, and mechanical stability of bismuth coatings plated with varying parameters were characterized via optical profilometry, cyclic voltammetry, electron microscopy, and tribology. Scratch testing on thick electroplated coatings (> 100 µm) revealed similar wear resistance properties between the pulse/reverse plated and direct current electroplated films. This study presents a versatile bismuth electroplating process with the possibility to replace lead in radiation shields with an inexpensive, non-toxic metal, or to make industrially relevant electrocatalytic devices.
Identifiants
pubmed: 36681686
doi: 10.1038/s41598-023-28042-z
pii: 10.1038/s41598-023-28042-z
pmc: PMC9867696
doi:
Substances chimiques
Bismuth
U015TT5I8H
Types de publication
Journal Article
Langues
eng
Sous-ensembles de citation
IM
Pagination
1202Informations de copyright
© 2023. The Author(s).
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