One-step high-speed thermal-electric aerosol printing of piezoelectric bio-organic films for wirelessly powering bioelectronics.


Journal

Science advances
ISSN: 2375-2548
Titre abrégé: Sci Adv
Pays: United States
ID NLM: 101653440

Informations de publication

Date de publication:
25 Oct 2024
Historique:
medline: 25 10 2024
pubmed: 25 10 2024
entrez: 25 10 2024
Statut: ppublish

Résumé

Piezoelectric biomaterials hold a pivotal role in the progression of bioelectronics and biomedicine, owing to their remarkable electromechanical properties, biocompatibility, and bioresorbability. However, their technological potential is restrained by certain challenges, including precise manipulation of nanobiomolecules, controlling their growth across nano-to-macro hierarchy, and tuning desirable mechanical properties. We report a high-speed thermal-electric driven aerosol (TEA) printing method capable of fabricating piezoelectric biofilms in a singular step. Electrohydrodynamic aerosolizing and in situ electrical poling allow instantaneous tuning of the spatial organization of biomolecular inks. We demonstrate TEA printing of β-glycine/polyvinylpyrrolidone films, and such films exhibit the piezoelectric voltage coefficient of 190 × 10

Identifiants

pubmed: 39453993
doi: 10.1126/sciadv.adq3195
doi:

Substances chimiques

Aerosols 0
Biocompatible Materials 0
Lead 2P299V784P
Glycine TE7660XO1C

Types de publication

Journal Article

Langues

eng

Sous-ensembles de citation

IM

Pagination

eadq3195

Auteurs

Xuemu Li (X)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.

Zhuomin Zhang (Z)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.
Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China.

Yi Zheng (Y)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.
Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China.

Junchen Liao (J)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.

Zehua Peng (Z)

Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China.

Pengyu Li (P)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.
Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China.

Xiaodan Yang (X)

Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China.

Xiaodong Yan (X)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.

Ying Hong (Y)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.
Institute of Electrical and Micro Engineering, École Polytechnique Fédérale de Lausanne, 1015 Lausanne, Switzerland.

Shiyuan Liu (S)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.

Yao Shan (Y)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.

Bee Luan Khoo (BL)

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.

Zhengbao Yang (Z)

Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China.

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Classifications MeSH